Cooling of electronic components on the LTCC module with an embedded flat heat pipe
نویسندگان
چکیده
منابع مشابه
Experimental Investigation on Thermal Performance of Cooling System Using Thermoelectric Module Integrated with Heat Pipe
ARTICLE INFO Cooling of electronics component is one of the major challenges faced by thermal engineers. In recent years, a significant increase in microprocessor power dissipation coupled with CPU size has resulted in an increase in heat fluxes. Microprocessor heat fluxes have also increased for many commercial applications. Therefore, thermal management is becoming one of most challenging iss...
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ژورنال
عنوان ژورنال: IOP Conference Series: Materials Science and Engineering
سال: 2021
ISSN: 1757-8981,1757-899X
DOI: 10.1088/1757-899x/1139/1/012002